Customized ASIC Design technology
Comprehensive ASIC development from concept to mass production. VTW delivers tailored silicon solutions engineered to meet end-user requirements in performance, power efficiency, and cost optimization.
Focused on near-memory computing and high-speed switch interconnects, VTW develops specialized chips for next-generation AIPC, AI inference, and system-level integration.
Advanced Technology
Backed by long-standing partnerships with top-tier foundries and OSAT providers,VTW delivers high-yield, high-reliability chip production tailored to customer needs.
Foundry Services
Technology and Solutions
Advanced Technology
VTW drives breakthroughs in switching, edge, and high-performance computing with advanced architectures and algorithms. Our chips deliver superior compute efficiency—built for next-gen AIPC, inference, and workloads requiring high tokens, wide bandwidth, and massive throughput.
Customized ASIC Design
VTW provides full-process ASIC design—from spec to silicon—including architecture, IP, DFT, and production. Our platform-based, customized approach—powered by trusted IP partners—helps clients shorten time-to-market with high-efficiency, product-oriented solutions.
Foundry Services
VTW partners with top-tier foundries and OSAT providers to deliver wafer and packaging services. Our production flow ensures high yield, consistent quality, and fast turnaround—supporting customers from final design to reliable, scalable mass manufacturing.
Products and Applications
Network Switching
Optimized for modern workloads, our high-speed interconnect solutions balance bandwidth, latency, and cost—leveraging advanced optics, Leaf-Spine/Clos topologies, and protocols like RDMA and lossless Ethernet. These solutions deliver scalable, low-latency performance purpose-built for next-generation data centers.
NPU Architecture Design
Designed specifically for deep learning models such as Transformers, CNNs, and RNNs, our dedicated acceleration chips outperform general-purpose CPUs and parallel GPUs. By optimizing matrix operations, tensor handling, and sparse computations at the hardware level, they deliver lower latency, reduced power consumption, and higher compute efficiency for both inference and training.
AIPC and Other Smart Terminals
A new generation of smart terminals is taking shape—smarter, faster, and more attuned to real-world needs, as AI moves from the cloud to the edge. At its core is a unified chip–system–application stack, transforming devices into intelligent companions—built for modern living.
Edge Computing
By bringing intelligence closer to where data is created, edge computing chips overcome the limits of cloud-only models—enabling real-time responsiveness, lower latency, and smarter energy use. With purpose-built hardware, they drive digital transformation and edge–cloud synergy, unlocking real-time intelligence, data sovereignty, and cost efficiency across industries.
